ARM: tegra: power: Add package mask to IO pad control
authorAlex Frid <afrid@nvidia.com>
Sun, 24 Jul 2011 03:14:25 +0000 (20:14 -0700)
committerDan Willemsen <dwillemsen@nvidia.com>
Sat, 14 Sep 2013 07:56:46 +0000 (00:56 -0700)
commit6b0793ceb18d84e531a49a3aff2b3a616d9fffdf
tree3208efc7800de47e378b3c78021e58ddb6dddc1d
parent69a544b94138240635cba88d4a7e0d715b8022df
ARM: tegra: power: Add package mask to IO pad control

Modified dynamic IO pad configuration control to support SoC package
dependencies: set into "no-io-power state" IO pads that are not bonded
out on the particular package. Updated IO power detect table to account
for differences in Tegra2 and Tegra3 architecture.

Bug 853132

Original-Change-Id: I5f0aedfa784173cc37251ccf4e1dfb4d919db96e
Reviewed-on: http://git-master/r/42785
Tested-by: Aleksandr Frid <afrid@nvidia.com>
Reviewed-by: Karan Jhavar <kjhavar@nvidia.com>
Reviewed-by: Scott Williams <scwilliams@nvidia.com>
Reviewed-by: Diwakar Tundlam <dtundlam@nvidia.com>
Tested-by: Diwakar Tundlam <dtundlam@nvidia.com>
Reviewed-by: Jonathan Mayo <jmayo@nvidia.com>

Rebase-Id: R46208845c32e25340de6b1cebfb6b617c6c7ce4d
arch/arm/mach-tegra/fuse.c
arch/arm/mach-tegra/fuse.h
arch/arm/mach-tegra/powerdetect.c
arch/arm/mach-tegra/tegra20_speedo.c
arch/arm/mach-tegra/tegra30_speedo.c